Semiconductor assembly and processing outsourcing: Dicing
Full cut and step cut compatible with dual spindle! Processing track record for wafer thickness of 725 to 100 μm and chip sizes of 0.5 mm or less!
Full cut and step cut compatible with dual spindles. Equipped with CO2 injectors and transport for ESD measures, as well as ionizers during cleaning. Additionally, please leave the blade selection and processing conditions to minimize chipping to us. 【Overview】 ■ LSI silicon wafers (Max 8 inches) ■ Quartz *For more details, please refer to the PDF document or feel free to contact us.
- Company：函館電子
- Price：Other
